Pressureless Silver Sintering Pastes Die-Attach for SiC Power Devices

Pressureless Silver Sintering Pastes Die-Attach for SiC Power Devices

SHAREX’s silver sintering pastes are high metal-loading materials designed to fit easily into a dispense process with no change of deposition equipment. The pastes can also use fast “reflow-like” (RFL) sintering processes to form strong joints on many standard leadframe, DBC, and IPM pad finishes, and will bond strongly to die with Ag, Au, or Cu surfaces.
Solder and many standard epoxy-silver materials are proving increasingly unsuitable for many discrete and small module device applications. They may, for example, be incapable of surviving the ambient conditions seen from longer mission profiles for automotive applications. These mission profiles typically drive longer high-temperature operating life (HTOL) and larger temperature swings in usage (thermally cycling).

SHAREX'S Silver Sintering Pastes Features & Benefits
Proven fast sintering with excellent joint strength
Pressureless sintering solution with pressurized sintering capabilities
Controllable bondline thickness from 30-70µm
Versatile sintering profiles
Voiding <1%
Porosity <3%
SHAREX‘s Silver Sintering pastes  advantage
High reliability
Highest electrical conductivity
High thermal conductivity
Higher than Cu
High temperature applications
Less reactive than Cu